ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux has been designed for use in the electronic industry to improve effectiveness in dip and wave soldering of conventional PCB assemblies.

Process Considerations:-

• The flux needs to be pre-heated post application in order to activate it.
• Recommended temperature may be anywhere between 90˚C to 150˚C (194˚F to 302˚F) depending upon circuit board design, board thickness, length of contact time with molten solder, speed of solder flow and preheating time.
• Solder pot temperature should be set between 245- 260˚C (473-500˚F) for Sn63Pb37/Sn60Pb40 alloy and between 260-270˚C (500-518˚F) for SnCu/SnAgCu alloys.
• Please note that the above are only guidelines and the optimum settings for a given assembly may vary keeping in mind the above mentioned factors.

• Flux residues are non-corrosive and non-conductive, thus do not require removal in most applications. In case residue removal is required our PCB Cleaner may be used for the same. 

Storage and Shelf Life:-

Applications :

• Application may be done manually using a brush or via spraying.

Specifications :

• Specific Gravity: 0.82±0.005
• Percent solids (theoretical): 1.5
• State: Liquid
• Acid number: 35.0mg KOH/g

Package Includes :

1 x ACE 1 Litre No Clean Flux 0% Soldering Liquid Flux