ACE 1Kg Silicone Heat Sink Compound  is  typically  a  white  paste Silicone  base  grease  like  material, which improve the thermal connection between the processor and heat sink. A thin layer of this is spread between the two, which greatly improves heat transfer and the cooling.

Heat  Sink  Compound is recommended as a heat transfer medium for use with all electronic components such as Power  transistors,  Diodes,  Resistors  etc.

Silicone Heat  Sink  Compound is  created  to  meet  the  need  for  a  non-contaminating and more efficient thermal transfer compound. It has a life expectancy far exceeding that of all known types of electronic circuitry in both normal and extreme environments. 

Usage  Instructions :

• Use  a  wood  stick  to  apply  a  small  quantity  of  the  thermal  compound  on  the  heat sink where contact is made with the processor.
• The contact area is much smaller than the physical size of the cooler and the processor. 
• Spread the compound slightly on the heat sink to cover the contact area with a thin film. Attach the heat sink to the processor.
• Move the heat sink slightly and gently against the processor. The goal is to eliminate the air gap.
• The heat generated by the processor once running will help dispersing the compound evenly. Do not over apply the paste.

Specifications :

• Color - White
• Texture - Smooth
• Penetration, worked 0.1 mm - 280
• Bleed at 24 Hrs. @ 200 ° C -0.2%
• Dropping Point ° C - + 240 
• Dielectric Strength - 115 Volts/mil 
• Specific Gravity / Density - 2.78
• Insulation Resistivity - 3 x 104  mega ohm
• Thermal conductivity at 35 °C - 1 W/mK.
• Weight- 1 kg 

Package Includes:

1 x ACE 1Kg Silicone Heat Sink Compound