MOS25 12 to 50V 25A 3D printer Heat Bed Power Expansion Module is based on power MOSFET and will allow PID control of 3D printer heat bed (DC-DC Relays usually do not allow this).

The module has MKS MOSFET for RAMPS 1.4 Heating-Controller with Max Current capacity of 25A. MOS25 can be stable long-term work when measured I (Max) = 25A. When using the module, the current should not exceed 25A.

Note: When using hot bed power greater than 150W, an external high power module is needed.

Features:

1. Application: with much larger heat sink, thereby operation without active cooling at higher currents possible suitable for anet a8, a6, a2; ramps; mk8; RepRap 3d printer
2. Unique design: with unique snowflake heat sink design, it has a great cooling effect the heat bed power module can be used in both large motherboard and other 3d printer motherboards
3. 30A max current: this high power module helps your 3d printer equipped with the lerdge controller board become even more powerful the module can solve the current load problem when the heated bed power is too large with this add-on module to board lead the maximum current up to 30a
4. Good protection: when using heated bed 3d printer for 12v power supply which may cause excessive current during times, with this module, it can well protect the connectors on the controller board from burning

Package Includes:

1 x MOS25 12 to 50V 25A 3D printer Heat Bed Power Expansion Module

1 x Connecting Cables

Specifications:

Input Voltage Range (VDC)	12 to 50
Cable lenght (cm)	30
Length (mm)	70
Width (mm)	45
Height (mm)	35
Weight (gm)	52